Display device

ABSTRACT

Provided is a display device including: a display panel in which a display area and a non-display area located around the display area are defined; an external device which is disposed on the non-display area of the display panel; and a cover member which is disposed on the external device, wherein the external device includes a driving chip and a printed circuit film which is disposed on the non-display area of the display panel and spaced apart from the display area with the driving chip interposed between the printed circuit film and the display area in plan view, and the cover member includes a first insulating tape disposed on the external device, a first conductive tape disposed on the first insulating tape and a second insulating tape disposed on the first conductive tape, wherein the second insulating tape includes an electrostatic induction opening penetrating the second insulating tape in a thickness direction, a planar size of the first conductive tape is greater than a planar size of the second insulating tape, the first conductive tape protrudes further toward the display area than the second insulating tape in plan view, and the electrostatic induction opening is disposed on a part of the first conductive tape which protrudes further toward the display area than the second insulating tape.

CROSS-REFERENCE

This application claims priority under 35 U.S.C. § 119 to Korean PatentApplication No. 10-2020-0003678 filed on Jan. 10, 2020 in the KoreanIntellectual Property Office, the disclosure of which is incorporated byreference herein in its entirety.

FIELD

The present disclosure relates to display devices, and moreparticularly, to a display device that can switch between a folded stateand an unfolded state.

DISCUSSION OF RELATED ART

A display device is a device for displaying an image, and generallyincludes a display panel such as an organic light emitting display panelor a liquid crystal display panel.

A mobile electronic device generally includes a display device toprovide an image to a user. The proportion of mobile electronic deviceshaving a larger display screen while having the same or smaller volumeor thickness than conventional mobile electronic devices is increasing,and foldable display devices or bendable display devices, such as thosestructured to be folded and unfolded in order to provide a larger screenonly when used, are also being developed.

Meanwhile, as a gap between a display panel of a display device and asurrounding set structure becomes narrow, static electricity introducedfrom the outside may cause a failure of the display device. Inparticular, when there is an insufficient bypass path of the staticelectricity introduced from the outside, the static electricity may flowto a driving chip and/or driving wirings around the driving chip,thereby causing a driving failure of the display device.

In addition, applying a thick structure or cover may be considered toprevent introduction of static electricity to the driving chip and thedriving wirings around the driving chip. However, due to miniaturizationof display devices, it may not be practical to apply an additionalstructure to protect the driving chip and the driving wirings around thedriving chip.

SUMMARY

Embodiments of the present disclosure may provide a display devicehaving a robust display screen resistant to external electromagneticstress, such as, for example, an electromagnetic pulse or staticelectricity. However, aspects of the present disclosure are notrestricted to the ones set forth herein. The above and other aspects ofthe present disclosure will become more apparent to those of ordinaryskill in the pertinent art to which the present disclosure pertains byreferencing the detailed description of the present disclosure givenbelow.

According to an exemplary embodiment of the present disclosure, there isprovided a display device including: a display panel in which a displayarea and a non-display area located around the display area are defined;an external device which is disposed on the non-display area of thedisplay panel; and a cover member which is disposed on the externaldevice, wherein the external device includes a driving chip and aprinted circuit film which is disposed on the non-display area of thedisplay panel and spaced apart from the display area with the drivingchip interposed between the printed circuit film and the display area inplan view, wherein the cover member includes a first insulating tapedisposed on the external device, a first conductive tape disposed on thefirst insulating tape and a second insulating tape disposed on the firstconductive tape, wherein the second insulating tape includes anelectrostatic induction opening penetrating the second insulating tapein a thickness direction, wherein a planar size of the first conductivetape is greater than a planar size of the second insulating tape,wherein the first conductive tape protrudes further toward the displayarea than the second insulating tape in plan view, and wherein theelectrostatic induction opening is disposed on a part of the firstconductive tape which protrudes further toward the display area than thesecond insulating tape.

The first insulating tape may be disposed between the first conductivetape and the external device, and the first conductive tape may bedisposed between the first insulating tape and the second insulatingtape.

The first insulating tape may include an electrostatic transfer openingoverlapping the printed circuit film, and the electrostatic transferopening may completely penetrate the first insulating tape in thethickness direction.

The cover member may further include a second conductive tape disposedin the electrostatic transfer opening, the second conductive tape may bedisposed between the first conductive tape and the printed circuit film,the second conductive tape may be configured to electrically connect thefirst conductive tape and the printed circuit film, and the printedcircuit film may be configured to receive a ground voltage.

The non-display area may further include a bending area located betweenthe driving chip and the display area in plan view, and the displaypanel may be bent in the thickness direction in the bending area.

The display device may further include a bending protection layer whichis disposed on the bending area of the display panel.

The display device may further include a step compensation member whichis disposed between the display panel and the first insulating tape.

The step compensation member may include a first step compensationmember disposed between the display panel and the first insulating tapeand a second step compensation member disposed between the first stepcompensation member and the first insulating tape, and an inner sidesurface of the first step compensation member may be located fartherfrom the bending area than an inner side surface of the second stepcompensation member.

Each of the first conductive tape and the second insulating tape mayinclude a first end extending along a first direction and adjacent tothe bending area and a second end extending along a second directionintersecting the first direction and connected to the first end, and thedriving chip and the printed circuit film may be spaced apart from eachother along the second direction.

The first end of the second insulating tape may be located closer to theexternal device than the first end of the first conductive tape in planview, and the second end of the first conductive tape and the second endof the second insulating tape may be aligned with each other.

The second end of the second insulating tape may be located closer tothe external device than the second end of the first conductive tape inplan view, and the first end of the first conductive tape and the firstend of the second insulating tape may be aligned with each other.

The first end of the second insulating tape may be located closer to theexternal device than the first end of the first conductive tape in planview, the second end of the second insulating tape may be located closerto the external device than the second end of the first conductive tapein plan view, and the first end of the first conductive tape and thefirst end of the second insulating tape may be aligned with each other.

Each of the first conductive tape and the second conductive tape mayinclude a side surface adjacent to the bending area, and the sidesurface of the second insulating tape may be located farther from thebending area than the side surface of the first conductive tape.

A folding area extending along the first direction, a first non-foldingarea located on a side of the folding area in the second direction, anda second non-folding area located on the other side of the folding areain the second direction may be further defined in the display panel.

According to an exemplary embodiment of the present disclosure, there isprovided a display device including: a display panel in which a displayarea and a non-display area located around the display area are defined;an external device which is disposed on the non-display area of thedisplay panel; and a cover member which is disposed on the externaldevice, wherein the external device includes a driving chip and aprinted circuit film which is disposed on the non-display area of thedisplay panel and spaced apart from the display area with the drivingchip interposed between the printed circuit film and the display area inplan view, wherein the cover member includes a first insulating tapedisposed on the external device, a first conductive tape disposed on thefirst insulating tape, a second insulating tape disposed on the firstconductive tape and a conductive layer disposed on the second insulatingtape, wherein the non-display area further comprises a bending arealocated between the driving chip and the display area in plan view andextending along a first direction, wherein when the display panel is ina first bent state, it is bent in a thickness direction in the bendingarea, wherein when the display panel is in a second unbent state, thedriving chip and the printed circuit film are spaced apart from eachother along a second direction intersecting the first direction, whereinthe second insulating tape includes an edge part extending along thefirst direction and adjacent to the bending area, and wherein theconductive layer overlaps the edge part of the second insulating tape.

Each of the first insulating tape, the second insulating tape and thefirst conductive tape may include a side surface adjacent to the bendingarea, and the side surfaces of the first insulating tape, the secondinsulating tape and the first conductive tape may be exposed.

Each of the first insulating tape, the second insulating tape and thefirst conductive tape may include a side surface adjacent to the bendingarea, and the conductive layer may be further disposed on the sidesurfaces of the second insulating tape and the first conductive tape.

The first insulating tape may include an electrostatic transfer openingoverlapping the printed circuit film, the electrostatic transfer openingmay completely penetrate the first insulating tape in the thicknessdirection, and the cover member may further include a second conductivetape disposed in the electrostatic transfer opening, wherein the secondconductive tape may be disposed between the first conductive tape andthe printed circuit film, the second conductive tape may be configuredto electrically connect the first conductive tape and the printedcircuit film, and the printed circuit film may be configured to receivea ground voltage.

The non-display area may further include a bending area located betweenthe driving chip and the display area in plan view, the display panelmay be bent in the thickness direction in the bending area, and thedisplay device may further include a bending protection layer disposedon the bending area of the display panel.

The display device may further include a step compensation member whichis disposed between the display panel and the first insulating tape,wherein the step compensation member may include a first stepcompensation member disposed between the display panel and the firstinsulating tape and a second step compensation member disposed betweenthe first step compensation member and the first insulating tape, and aninner side surface of the first step compensation member may be locatedfarther from the bending area than an inner side surface of the secondstep compensation member.

According to an exemplary embodiment of the present disclosure, aflexible display panel includes: a display area; a non-display arealocated around the display area; a grounded film disposed on thenon-display area and spaced apart from the display area; a coverdisposed on the grounded film and comprising a first insulating tapedisposed on the grounded film, a conductive tape disposed on the firstinsulating tape, and a second insulating tape disposed on the conductivetape, wherein the first insulating tape comprises at least oneelectrostatic transfer opening extending between the conductive tape andthe grounded film.

The flexible display panel may include an electrostatic inductionopening defined where a planar size of the conductive tape is greaterthan a planar size of the second insulating tape. The flexible displaypanel may include an electrostatic induction opening defined where theconductive tape extends further towards the display area than the secondinsulating tape. The flexible display panel may include an electrostaticinduction opening defined where the conductive tape extends furtherperpendicular to the display area than the second insulating tape. Theflexible display panel may be configured so the at least oneelectrostatic transfer opening is disposed in a part of the firstinsulating tape where the conductive tape extends further towards thedisplay area than the second insulating tape to define an electrostaticinduction opening.

The flexible display panel may be configured so the second insulatingtape is thinner than the conductive tape, and may include a conductivelayer disposed on the second insulating tape to define an electrostaticattractor. The flexible display panel may include a conductive sleevedisposed in the at least one electrostatic transfer opening between theconductive tape and the grounded film, the conductive sleeve configuredto electrically connect the conductive tape to the grounded film.

BRIEF DESCRIPTION OF THE DRAWINGS

These and/or other aspects may become more apparent and more readilyappreciated from the following description of exemplary embodiments,when taken in conjunction with the accompanying drawings, in which:

FIG. 1 is a layout diagram in plan view of a display device according toan exemplary embodiment in a first operating or unfolded state;

FIG. 2 is a schematic diagram in cross-sectional view of a display panelof FIG. 1 in a second operating or folded state;

FIG. 3 is a schematic diagram in cross-sectional view of the displaydevice of FIG. 1 when in an unbent state;

FIG. 4 is a schematic diagram in cross-sectional view of the displaydevice of FIG. 1 when in a bent state;

FIG. 5 is a schematic diagram in cross-sectional view of a display panelaccording to an exemplary embodiment;

FIG. 6 is partial layout diagram in a plan view of a non-display area ofthe display panel of the display device according to the embodiment ofFIG. 1, with a driving chip, a printed circuit film, a cover member, anda step compensation member when the display device is unbent;

FIG. 7 is a schematic diagram in cross-sectional view taken along lineI-I′ of the display device of FIG. 6 when the display device is bent;

FIG. 8 is a hybrid diagram in cross-sectional view that illustratesinduction of external static electricity through an electrostaticinduction opening in an exemplary embodiment;

FIG. 9 is a partial layout diagram in plan view of a non-display area ofa display panel according to an exemplary embodiment, with a drivingchip, a printed circuit film, a cover member, and a step compensationmember when the display panel is unbent;

FIG. 10 is a schematic diagram in cross-sectional view taken along lineII-II′ of FIG. 9 when the display panel is bent;

FIG. 11 is a schematic diagram in cross-sectional view taken along lineIII-III′ of FIG. 9 when the display panel is bent;

FIG. 12 is partial layout diagram in a plan view of a non-display areaof a display panel according to an exemplary embodiment, with a drivingchip, a printed circuit film, a cover member, and a step compensationmember when the display panel is unbent;

FIG. 13 is a schematic diagram in cross-sectional view of a displaydevice according to an exemplary embodiment; and

FIG. 14 is a schematic diagram in cross-sectional view of a displaydevice according to an exemplary embodiment.

DETAILED DESCRIPTION

Exemplary embodiments of the present disclosure and methods ofaccomplishing the same may be understood more readily by reference tothe following detailed description of exemplary embodiments and theaccompanying drawings. The present disclosure may, however, be embodiedin many different forms and should not be construed as being limited tothe exemplary embodiments set forth herein. Rather, these exemplaryembodiments are provided so that this disclosure will be thorough andcomplete and will fully convey the concept of the invention to thoseskilled in the art, where the scope of the present disclosure may onlybe defined by the appended claims and their equivalents.

It will be understood that when an element or layer is referred to asbeing “on” another element or layer, the element or layer can bedirectly on another element or layer or on intervening elements orlayers. Like numbers may refer to like elements throughout thespecification.

A display device may be used for displaying moving images or stillimages. The display device may be used as a display screen in portableelectronic devices such as mobile phones, smartphones, tablet personalcomputers (PCs), smart watches, watch phones, mobile communicationsterminals, electronic notebooks, electronic books, portable multimediaplayers (PMPs), navigation systems and ultra-mobile PCs (UMPCs), as wellas in various products such as televisions, notebook computers,monitors, billboards and the Internet of things (IoT). Hereinafter,embodiments will be described with reference to the attached drawings.

FIG. 1 illustrates a plan layout view of a display device 1 according toan exemplary embodiment in a first operating or unfolded state. FIG. 2illustrates a cross-sectional view of a display panel 10 of FIG. 1 in asecond operating or folded state.

Referring to FIGS. 1 and 2, the display device 1 may display a screen oran image through a display area DA and may be any device including thedisplay area DA. Examples of the display device 1 may include, but arenot limited to, a smartphone, a mobile phone, a tablet PC, a personaldigital assistant (PDA), a PMP, a television, a game machine, awristwatch-type electronic device, a head mounted display, a monitor ofa PC, a notebook computer, a car navigation system, a car dashboard, adigital camera, a camcorder, an external billboard, an electronic board,various medical devices, various examination devices, various homeappliances including the display area DA, such as a refrigerator and awashing machine, and IoT devices. A representative example of a foldabledisplay device to be described later may be, but is not limited to, afoldable smartphone, a foldable tablet PC, or a foldable notebookcomputer.

The display device 1 may be substantially rectangular in plan view. Thedisplay device 1 may be shaped like a rectangle with right-angledcorners or a rectangle with rounded corners in plan view. The displaydevice 1 shaped like a rectangle with rounded corners in plan view willbe mainly described below. The display device 1 may include four sidesor edges. The display device 1 may include long sides and short sides.The display device may have any shape in plan view, without limitation.For example, an alternate embodiment display device may be substantiallytrigonal, hexagonal, octagonal, or circular in plan view.

The short sides of the display device 1 may extend along a direction,and the long sides of the display device 1 may extend along anotherdirection. For example, the short sides may extend along a firstdirection DR1, and the long sides may extend along a second directionDR2. In embodiments, the first direction DR1 and the second directionDR2 intersect each other in different directions. In the plan view ofFIG. 1, the first direction DR1 is defined as a horizontal direction,and the second direction DR2 is defined as a vertical direction for easeof description. In the following embodiments, a first side of the firstdirection DR1 refers to a right direction in plan view, a second side ofthe first direction DR1 refers to a left direction in plan view, a firstside of the second direction DR2 refers to an upper direction in planview, and a second side of the second direction DR2 refers to a lowerdirection in plan view. However, directions mentioned in embodimentsshould be understood as relative directions, and the embodiments are notlimited to the mentioned directions.

The display device 1 may include the display panel 10 displaying animage, an external device attached to the display panel 10, and a covermember 70 covering the external device. The external device may includea driving chip 30 and a printed circuit film 50 spaced apart from thedriving chip 30 along the second direction DR2. The cover member 70 maycompletely cover the driving chip 30 and partially cover the printedcircuit film 50.

The display panel 10 is a panel that displays a screen or an image.Examples of the display panel 10 may include a self-luminous displaypanel such as an organic light emitting display (OLED) panel, aninorganic electroluminescent (EL) display panel, a quantum dot lightemitting display (QED) panel, a micro-light emitting diode (LED) displaypanel, a nano-LED display panel, a plasma display panel (PDP), a fieldemission display (FED) panel or a cathode ray tube (CRT) display paneland a light receiving display panel such as a liquid crystal display(LCD) panel or an electrophoretic display (EPD) panel. An OLED panelwill hereinafter be described as an example of the display panel 10. TheOLED panel applied to embodiments will be simply referred to as thedisplay panel 10 unless a particular distinction is described. However,embodiments are not limited to the OLED panel, and other display panelslisted above or known in the art are also applicable within the scopeand technical spirit of the present disclosure.

The display panel 10 may include a first surface and a second surface.In the display device 1, a direction from the second surface toward thefirst surface of the display panel 10 may be a display direction, and adirection from the first surface toward the second surface may be anon-display direction. However, embodiments are not limited to thiscase, and both the direction from the second surface toward the firstsurface of the display panel 10 and the direction from the first surfacetoward the second surface may also be display directions.

The display device 1 may be a foldable device. The term “foldabledevice,” as used herein, refers to a device that can be folded and isused to mean not only a folded device but also a device that can haveboth a folded state and an unfolded state. In addition, when a device isfolded, it typically means that the device is folded at an angle ofabout 180 degrees. However, embodiments are not limited to this case.The device may also be understood as being folded even when the foldingangle is greater or less than 180 degrees, for example, 90 to less than180 degrees or 120 to less than 180 degrees. Furthermore, the device maybe referred to as being in the folded state when it is folded out of theunfolded state although it is not completely folded to its maximumfolding angle (e.g., 180 degrees). For example, even when the device isfolded at an angle of 90 degrees or less, it may be expressed as beingin the folded state to distinguish its state from the unfolded state aslong as the maximum folding angle is 90 degrees or more. When the deviceis folded, a radius of curvature may be, but is not limited to, 5 mm orless, preferably in the range of 1 to 2 mm, or about 1.5 mm.

Hereinafter, the folded state described above may be referred to as thefirst operating state, and the unfolded state described above may bereferred to as the second operating state.

A folding area FA, such as at a folding axis, and non-folding areas NFA1and NFA2, such as away from the folding axis, may be defined in thedisplay panel 10.

As illustrated in FIG. 2, the display panel 10 may be folded based onthe folding area FA, or the folding axis, in the second operating state.

The folding area FA may have a linear shape extending along the firstdirection DR1 in plan view. Although the folding area FA extendsparallel to the short sides of the display device 1 in the drawings,embodiments are not limited to this case. The folding area FA may alsobe parallel to the long sides or inclined with respect to the shortsides and the long sides.

In an embodiment, the folding area FA of the display device 1 may be setat a specific position. In the display device 1, the number of thefolding areas FA set at specific positions may be one or two or more. Inan embodiment, the position of the folding area FA in the display device1 need not be fixed but may be freely set in various areas.

A first non-folding area NFA1 may be located on a first side of thefolding area FA in the second direction DR2, and a second non-foldingarea NFA2 may be located on a second side of the folding area FA in thesecond direction DR2. When the folding area FA is set at a specificposition, the first non-folding area NFA1 and the second non-foldingarea NFA2 may be set as areas that are not folded.

The display panel 10 may, in plan view, be divided into the display areaDA displaying an image and a non-display area NDA disposed around thedisplay area DA, according to whether an image is displayed.

The display area DA may include a plurality of pixels. Each of thepixels is a basic unit for displaying a screen. The pixels may include,but are not limited to, red pixels, green pixels, and blue pixels. Thepixels may further include white pixels. The pixels may be alternatelyarranged in plan view. For example, the pixels may be arranged in amatrix direction.

The non-display area NDA may be disposed around the display area DA. Thenon-display area NDA may surround the display area DA. In an embodiment,the display area DA may be rectangular, and the non-display area NDA maybe disposed around four sides of the display area DA.

The rectangular shape of the display area DA may include, for example,short sides extending along the first direction DR1 and long sidesextending along the second direction DR2. The non-display area NDA maybe disposed around the short sides and the long sides of the displayarea DA. A black matrix may be disposed on the non-display area NDA ofthe display panel 10 to prevent leakage of light emitted from adjacentpixels.

The display area DA of the display panel 10 may be disposed over boththe first non-folding area NFA1 and the second non-folding area NFA2.Furthermore, the display area DA may be located in the folding area FAcorresponding to a boundary between the first non-folding area NFA1 andthe second non-folding area NFA2. That is, the display area DA of thedisplay device 1 may be continuously disposed regardless of boundariesbetween the non-folding areas NFA1 and NFA2 and the folding area FA.However, embodiments are not limited to this case, and the display areaDA may also be disposed in the first non-folding area NFA1 but need notbe disposed in the second non-folding area NFA2. Alternatively, thedisplay area DA may be disposed in the first non-folding area NFA1 andthe second non-folding area NFA2 but need not be disposed in the foldingarea FA.

Like the display area DA, the non-display area NDA may be located in thefirst non-folding area NFA1, the second non-folding area NFA2, and thefolding area FA.

Referring to FIG. 2, in the second operating state, the display device 1may be in-folded such that parts of the first surface of the displaypanel 10 face each other. In the second operating state, the displaydevice 1 may be folded such that a surface of the first non-folding areaNFA1 of the display panel 10 faces a surface of the second non-foldingarea NFA2.

In some embodiments, the display device 1 may be out-folded such thatparts of the second surface of the display panel 10 face each other. Thedisplay device 1 might be only in-folded or out-folded or may be bothin-folded and out-folded. The display device 1 that can be bothin-folded and out-folded may be in-folded and out-folded based on thesame folding area FA or may include a plurality of folding areas FA thatare folded differently based on an in-folding line or axis and anout-folding line or axis.

The non-display area NDA disposed around the long sides and the shortsides of the display area DA may have, for example, a substantiallyquadrilateral frame shape with rounded corners in plan view. Aquadrilateral frame shape with rounded corners may be formed by an outerprofile of the display area DA, first and second outer profiles (wherethe first outer profile is adjacent to a long side of the display areaDA on the second side of the first direction DR1, and the second outerprofile is opposite the first outer profile) of the non-display area NDAwhich are adjacent to the long sides of the display area DA and extendalong the second direction DR2, a third outer profile of the non-displayarea NDA which is adjacent to a short side of the display area DA on thefirst side of the second direction DR2 and extends along the firstdirection DR1, a fourth outer profile of the non-display area NDA whichis adjacent to a short side of the display area DA on the second side ofthe second direction DR2 and extends along the first direction DR1, andfour curved profiles which connect adjacent outer profiles of thenon-display area NDA.

The non-display area NDA adjacent to the short side of the display areaDA located on the second side of the second direction DR2 may furtherinclude a protruding part which protrudes further outward than thefourth outer profile. A width of the protruding part of the non-displayarea NDA in the first direction DR1 may be smaller than a width of thefourth outer profile in the first direction DR1. The width of theprotruding part of the non-display area NDA in the first direction DR1may be gradually reduced toward the second side of the second directionDR2, but embodiments are not limited to this case.

The protruding part may include a bending area BA. The bending area BAmay have a line shape extending along the first direction DR1. Thebending area BA may overlap the fourth outer profile. However,embodiments are not limited to this case, and the bending area BA mayalso be located closer to the second side of the second direction DR2than the fourth outer profile. In the bending area BA of the non-displayarea NDA, the display panel 10 may be bent in a thickness direction. Thedisplay device 1 according to the embodiment may be not only a foldabledevice but also a bendable device in which the display panel 10 can bebent. The display panel 10 may be bent based on the bending area BA.When the display device 1 is bent, parts of the second surface of thedisplay panel 10 may face each other.

The protruding part may be surrounded by a first curved profileconnecting the first outer profile and the fourth outer profile, asecond curved profile connecting the second outer profile and the fourthouter profile, a fifth outer profile connecting the first curved profileand the second curved profile, and the fourth outer profile. The fifthouter profile may extend along the first direction DR1. Each of thecurved profiles may have, but is not limited to, a curved shapeprotruding inward.

The external device may be attached to a second side of the bending areaBA of the protruding part in the second direction DR2. An attachmentposition of the driving chip 30 may be located between an attachmentposition of the printed circuit film 50 and the bending area BA. In thefirst operating state, the driving chip 30 may be located between theprinted circuit film 50 and the display area DA or between the printedcircuit film 50 and the bending area BA in plan view.

The driving chip 30 may include a driving integrated circuit configuredto apply a data voltage to each pixel and control data voltageapplication and/or scan signal application. A plurality of driving padsmay be disposed at the attachment position of the driving chip 30 in thenon-display area NDA, and the driving chip 30 may be attached to thedriving pads.

The printed circuit film 50 may be configured to provide a data voltagesignal and a data voltage application control signal and/or a scansignal application control signal to the driving chip 30. In addition,the printed circuit film 50 may be configured to provide a high-voltagepotential signal and a low-voltage potential signal to each pixel.

The printed circuit film 50 may further include a connector 51 locatedat an end on the second side of the second direction DR2. The connector51 may be connected to a main circuit board.

The cover member 70 may be disposed on the driving chip 30 and theprinted circuit film 50. The cover member 70 may overlap the whole ofthe driving chip 30 and part of the printed circuit film 50. The covermember 70 may be disposed on the attachment positions of the drivingchip 30 and the printed circuit film 50 on the non-display area NDA ofthe display panel 10.

FIG. 3 illustrates a cross-sectional view of the display device 1 ofFIG. 1 when unbent. FIG. 4 illustrates a cross-sectional view of thedisplay device 1 of FIG. 1 when bent. FIG. 5 illustrates across-sectional view of a display panel 10 according to an embodiment.

Referring to FIGS. 3 through 5, the display panel 10 may include aplurality of elements. For example, the display panel 10 may include asubstrate 11 and a circuit driving layer 12 disposed on the substrate11. The circuit driving layer 12 may include a circuit for driving alight emitting layer 13 of each pixel. The circuit driving layer 12 mayinclude a plurality of thin-film transistors. The light emitting layer13 may be disposed on the circuit driving layer 12. The light emittinglayer 13 may include an organic light emitting layer. The light emittinglayer 13 may emit light of various luminance levels according to adriving signal received from the circuit driving layer 12. Anencapsulating layer 14 may be disposed on the light emitting layer 13.The encapsulating layer 14 may include an inorganic layer or a laminateof an inorganic layer and an organic layer. Alternatively, theencapsulating layer 14 may be glass or an encapsulating film. A touchlayer 15 may be disposed on the encapsulating layer 14. The touch layer15 is a layer for recognizing a touch input and may function as a touchmember. The touch layer 15 may include a plurality of sensing regionsand sensing electrodes. A polarizing layer POL may be disposed on thetouch layer 15. The polarizing layer POL may reduce reflection ofexternal light. The polarizing layer POL may be attached to the touchlayer 15 through an adhesive layer. The polarizing layer POL isoptional. A protective layer may be disposed on the polarizing layerPOL. The protective layer may include, for example, a window member. Theprotective layer may be attached onto the polarizing layer POL by, e.g.,an optically clear adhesive.

In FIGS. 3 and 4, only the substrate 11 and the polarizing layer POLdisposed on the substrate 11 are illustrated by simplifying thecross-sectional structure of the display panel 10 for ease ofdescription.

The polarizing layer POL may be disposed on a first surface of thesubstrate 11. Like the first surface of the display panel 10 describedabove with reference to FIGS. 1 and 2, the first surface of thesubstrate 11 may be an upper surface of the substrate 11 in thedrawings, and a second surface of the substrate 11 may be a surface (alower surface) opposite the first surface of the substrate 11. Thepolarizing layer POL may be disposed in the display area DA and may notbe disposed in the non-display area NDA.

The display device 1 may further include an under-panel sheet 90disposed on the second surface of the substrate 11. The under-panelsheet 90 may include a polymer film layer 91 and a metal plate 95disposed under the polymer film layer 91.

The polymer film layer 91 may include a polymer film. The polymer filmlayer 91 may include, for example, polyimide (PI), polyethyleneterephthalate (PET), polycarbonate (PC), polyethylene (PE),polypropylene (PP), polysulfone (PSF), polymethyl methacrylate (PMMA),triacetyl cellulose (TAC), or cyclo olefin polymer (COP). The polymerfilm layer 91 may include a functional layer on at least one surface.The functional layer may include, for example, a light absorbing layer.The light absorbing layer may include a light absorbing material such asa black pigment or dye. The light absorbing layer may be formed on thepolymer film by coating or printing black ink.

The metal plate 95 dissipates heat generated from the display panel 10or other parts of the display device 1. The metal plate 95 may include ametallic plate. The metallic plate may contain a metal with excellentthermal conductivity, such as copper or silver. The metal plate 95 mayalso be a heat dissipating sheet containing graphite or carbonnanotubes.

The metal plate 95 may be divided by a folding line FDA as illustratedin FIGS. 3 and 4 to facilitate the folding of the display device 1,although embodiments are not limited to this case. For example, a firstmetal plate may be disposed in the first non-folding area NFA1, and asecond metal plate may be disposed in the second non-folding area NFA2.The first metal plate and the second metal plate may be physicallyseparated by the folding line FDA.

The display device 1 may further include a bending protection layer BPL.The bending protection layer BPL may be disposed on the first surface ofthe substrate 11 in the bending area BA.

The bending protection layer BPL may alleviate stress applied to asignal line (e.g., a signal line connecting each pixel and a drivingpad) passing through the bending area BA, thereby preventing creation ofcracks in the signal line.

For example, the bending protection layer BPL may include an organicmaterial. The organic material may include a photosensitive organicmaterial. For example, the bending protection layer BPL may include anacrylic material.

The bending protection layer BPL may extend further toward the displayarea DA from the bending area BA. The bending protection layer BPL maycontact an outer side surface of the polarizing layer POL. However,embodiments are not limited to this case, and the bending protectionlayer BPL need not contact the outer side surface of the polarizinglayer POL.

The driving chip 30, the printed circuit film 50 and a step compensationmember 80 may be disposed on a first side of the bending area BA in thesecond direction DR2 in the non-display area NDA of the display panel10. The step compensation member 80 may be disposed between the drivingchip 30 and the bending protection layer BPL, and the driving chip 30may be disposed between the step compensation member 80 and the printedcircuit film 50. The cover member 70 may be disposed on the stepcompensation member 80, the driving chip 30, and the printed circuitfilm 50.

A ground voltage may be applied to the printed circuit film 50. Forexample, the printed circuit film 50 may be grounded.

As illustrated in FIG. 4, when the display device 1 is bent, parts ofthe second surface of the display panel 10 may face each other. Each ofthe attachment position of the driving chip 30 and the attachmentposition of the printed circuit film 50 may overlap the non-display areaNDA between the display area DA and the bending area BA of the displaypanel 10 in the thickness direction.

As the display device 1 is bent, the printed circuit film 50 may bepositioned inside the driving chip 30 (for example, in a directiontoward the display area DA), and conversely, the driving chip 30 may bepositioned outside the printed circuit film 50 (for example, in adirection opposite to the direction toward the display area DA).

When the display device 1 is bent, since the driving chip 30 ispositioned outside the printed circuit film 50 (for example, in thedirection opposite to the direction toward the display area DA), it maybe located on the periphery of the display device 1. The driving chip 30located on the periphery and driving pads connected to the driving chip30 may be vulnerable to static electricity introduced directly from theoutside. In addition, since the driving chip 30 and the driving padsconnected to the driving chip 30 are disposed adjacent to a surroundingset structure, they may be vulnerable to static electricity transferredfrom the surrounding set structure into which static electricity hasbeen initially introduced. The static electricity introduced directlyfrom the outside and the static electricity introduced indirectly maycause a failure of the driving chip 30 and the driving pads, if no otherelectrostatic discharge path is provided, and the failure may cause ascreen failure of the display device 1.

FIG. 6 illustrates a plan view of the non-display area NDA of thedisplay panel 10 of the display device 1 according to the embodiment,including the driving chip 30, the printed circuit film 50, the covermember 70, and the step compensation member 80 when the display device 1is unbent. FIG. 7 illustrates a cross-sectional view taken along lineI-I′ of the display device 1 of FIG. 6 when the display device 1 isbent. Since FIG. 7 is a cross-sectional view of the display device 1 ofFIG. 6 when the display device 1 is bent, the external device isdisposed under the display panel 10, and the cover member 70 is disposedunder the external device in the drawing.

Referring to FIGS. 6 and 7, the cover member 70 may completely cover thedriving chip 30 and partially cover the printed circuit film 50. Thecover member 70 may include a first insulating tape 71 disposed on theexternal device, a first conductive tape 75 disposed on the firstinsulating tape 71, and a second insulating tape 77 disposed on thefirst conductive tape 75. The first insulating tape 71 may includeelectrostatic transfer openings OP1. This may be described later ingreater detail.

A planar size of the first insulating tape 71 may be substantially equalto a planar size of the first conductive tape 75. The planar size of thefirst conductive tape 75 may be greater than a planar size of the secondinsulating tape 77. In other words, the planar size of the secondinsulating tape 77 may be smaller than the planar size of the firstconductive tape 75.

The cover member 70 may have a substantially rectangular planar shape.The cover member 70 may include a first end extending along the firstdirection DR1 and adjacent to the bending area BA in plan view andsecond and third ends connected to the first end and extending along thesecond direction DR2. The second end of the cover member 70 may face andbe adjacent to a profile of the protruding part of the display panel 10on the second side of the first direction DR1, and the third end of thecover member 70 may face and be adjacent to a profile of the protrudingpart of the display panel 10 on the first side of the first directionDR1. The first end of the cover member 70 may include a straight lineextending along the first direction DR1. The first end of the covermember 70 may be composed of one straight line extending along the firstdirection DR1. In some embodiments, the first end may be composed of aplurality of straight lines extending in different directions. Each ofthe second and third ends of the cover member 70 may include a straightline extending along the second direction DR2. Each of the second andthird ends of the cover member 70 may be composed of one straight lineextending along the second direction DR2. In some embodiments, each ofthe second and third ends may be composed of a plurality of straightlines extending in different directions.

Each of the first insulating tape 71, the first conductive tape 75, andthe second insulating tape 77 may include ends corresponding to thefirst through third ends of the cover member 70.

For example, the first insulating tape 71, the first conductive tape 75and the second insulating tape 77 may respectively include first ends 71a, 75 a and 77 a corresponding to the first end of the cover member 70,second ends 71 b, 75 b and 77 b corresponding to the second end of thecover member 70, and third ends 71 c, 75 c and 77 c corresponding to thethird end of the cover member 70. The ends of each of the firstinsulating tape 71, the first conductive tape 75 and the secondinsulating tape 77 may be substantially the same as the correspondingends of the cover member 70 in extending direction and position.

The second ends 71 b and 75 b of the first insulating tape 71 and thefirst conductive tape 75 may be aligned with the second end 77 b of thesecond insulating tape 77, and the third ends 71 c and 75 c of the firstinsulating tape 71 and the first conductive tape 75 may be aligned withthe third end 77 c of the second insulating tape 77.

On the other hand, the first ends 71 a and 75 a of the first insulatingtape 71 and the first conductive tape 75 may not be aligned with thefirst end 77 a of the second insulating tape 77 and may be asymmetricalto the first end 77 a of the second insulating tape 77 in the thicknessdirection. For example, the first ends 71 a and 75 a of the firstinsulating tape 71 and the first conductive tape 75 may be locatedcloser to the bending area BA than the first end 77 a of the secondinsulating tape 77. As described above, the planar size of the secondinsulating tape 77 may be smaller than the planar size of the firstconductive tape 75. This may be because the first end 77 a of the secondinsulating tape 77 is located farther from the bending area BA than thefirst ends 71 a and 75 a of the first insulating tape 71 and the firstconductive tape 75.

Since the planar size of the second insulating tape 77 is smaller thanthe planar size of the first conductive tape 75 and the first end 77 aof the second insulating tape 77 is located farther from the bendingarea BA than the first ends 71 a and 75 a of the first insulating tape71 and the first conductive tape 75, each of the first insulating tape71 and the first conductive tape 75 may be located closer to the displayarea DA or the bending area BA than the first end 77 a of the secondinsulating tape 77. In other words, the second insulating tape 77 may belocated farther from the display area DA or the bending area BA than thefirst ends 71 a and 75 a of the first insulating tape 71 and the firstconductive tape 75. The second insulating tape 77 may be located closerto the external device than the first ends 71 a and 75 a of the firstinsulating tape 71 and the first conductive tape 75.

An electrostatic induction opening OP2 of the second insulating tape 77may be located in a part of each of the first insulating tape 71 and thefirst conductive tape 75 which protrudes further toward the display areaDA or the bending area BA than the first end 77 a of the secondinsulating tape 77. In plan view, the electrostatic induction openingOP2 may be surrounded by the first end 75 a, the second end 75 b and thethird end 75 c of the first conductive tape 75 and the first end 77 a ofthe second insulating tape 77. The electrostatic induction opening OP2may completely penetrate the second insulating tape 77 in the thicknessdirection from a surface of the second insulating tape 77.

In the electrostatic induction opening OP2, a part of the firstconductive tape 75 which protrudes further toward the display area DA orthe bending area BA than the first end 77 a of the second insulatingtape 77 may be completely exposed to the outside.

The electrostatic transfer openings OP1 may completely penetrate thefirst insulating tape 71 from a surface of the first insulating tape 71.The electrostatic transfer openings OP1 may overlap the cover member 70and the printed circuit film 50 in the thickness direction. Theelectrostatic transfer openings OP1 may overlap the display panel 10 inthe thickness direction, but embodiments are not limited to this case.Although three electrostatic transfer openings OP1 are illustrated inFIG. 6, the number of the electrostatic transfer openings OP1 may alsobe one, two, or four or more.

The step compensation member 80 may be disposed between the bending areaBA and the driving chip 30 in plan view. The step compensation member 80may compensate for a step or a space created between the display panel10 and the cover member 70 due to the external device. The stepcompensation member 80 may prevent warpage of the cover member 70 bycompensating for the step or the space between the display panel 10 andthe cover member 70. Therefore, the step compensation member 80 mayinclude a material having a certain degree of strength or rigidity.

The step compensation member 80 may include a first step compensationmember 81 disposed on the display panel 10 and a second stepcompensation member 85 disposed on the first step compensation member81. The first step compensation member 81 may be disposed between thesecond step compensation member 85 and the display panel 10. The firststep compensation member 81 and the second step compensation member 85may overlap each other in the thickness direction. The second stepcompensation member 85 may further include a part protruding furthertoward the bending are BA than the first step compensation member 81. Inother words, the first step compensation member 81 may further include apart recessed further toward the external device than the second stepcompensation member 85. The recessed part of the first step compensationmember 81 may be designed to avoid interference between a bendingprotection layer material flowing around the step compensation member 80and the step compensation member 80 because the bending protection layermaterial may flow around the step compensation member 80 when thebending protection layer BPL is coated in the bending area BA.

The first insulating tape 71 may protect the driving chip 30 bycompletely covering the driving chip 30.

The first insulating tape 71 may include a first base 72 and a firstbonding layer 73, the first conductive tape 75 may include a second base76 and a second bonding layer 77, and the second insulating tape 77 mayinclude a third base 78 and a third bonding layer 79.

Each of the bases 72 and 78 may include at least one of polyethyleneterephthalate (PET), polyimide (PI), polycarbonate (PC), polyethylene(PE), polypropylene (PP), polysulfone (PSF), polymethyl methacrylate(PMMA), triacetyl cellulose (TAC), and cyclo olefin polymer (COP).

Each of the bonding layers 73, 77 and 79 may include an adhesive layer,a sticky layer, or a resin layer. For example, each of the bondinglayers 73, 77 and 79 may contain a polymer material classified assilicone-based, urethane-based, silicone-urethane (SU) hybrid polymer,acrylic-based, isocyanate-based, polyvinyl alcohol-based, gelatin-based,vinyl-based, latex-based, polyester-based, or aqueous polyester-based.In an embodiment, the second bonding layer 77 may further include aconductive material.

The second base 76 may include a conductive layer. The conductive layermay include a metal or a metal oxide.

In each of the electrostatic transfer openings OP1, the first insulatingtape 71 may be completely penetrated in the thickness direction. Asecond conductive tape 81 may be further disposed in each of theelectrostatic transfer openings OP1. The cover member 70 may furtherinclude the second conductive tape 81. The second conductive tape 81 mayinclude a fourth base 82 and a fourth bonding layer 83. The fourth base82 may include a conductive layer. The conductive layer may include ametal or a metal oxide. The fourth bonding layer 83 may include anadhesive layer, a sticky layer, or a resin layer. In an embodiment, thefourth bonding layer 83 may further include a conductive material.

The first base 72 may be bonded to the driving chip 30, the printedcircuit film 50 and the step compensation member 80 through the firstbonding layer 73, the second base 76 may be bonded to the first base 72through the second bonding layer 77, the third base 78 may be bonded tothe second base 76 through the third bonding layer 79, the fourth base82 may be bonded to the second base 76 through the second bonding layer77, and the fourth base 82 may be bonded to the printed circuit film 50through the fourth bonding layer 83.

The first insulating tape 71, the first conductive tape 75 and thesecond insulating tape 77 may respectively include side surfaces 71S1,75S1 and 77S1 of the first ends 71 a, 75 a and 77 a adjacent to thebending area BA. The side surface 71S1 of the first insulating tape 71and the side surface 75S1 of the first conductive tape 75 may be alignedin the thickness direction. The side surface 77S1 of the secondinsulating tape 77 may be located farther from the bending area BA thanthe side surface 71S1 of the first insulating tape 71 and the sidesurface 75S1 of the first conductive tape 75. In other words, the sidesurface 71S1 of the first insulating tape 71 and the side surface 75S1of the first conductive tape 75 may be located closer to the bendingarea BA than the side surface 77S1 of the second insulating tape 77, andthe side surface 77S1 of the second insulating tape 77 may be locatedcloser to the external device than the side surface 71S1 of the firstinsulating tape 71 and the side surface 75S1 of the first conductivetape 75.

A gap W1 between the side surface 77S1 of the second insulating tape 77and the side surface 75S1 of the first conductive tape 75 may be equalto a gap between the first end 77 a of the second insulating tape 77 andthe first end 75 a of the first conductive tape 75. The gap W1 betweenthe side surface 7751 of the second insulating tape 77 and the sidesurface 7551 of the first conductive tape 75 may be equal to a width ofthe electrostatic induction opening OP2 in the second direction DR2.

The gap W1 between the side surface 7751 of the second insulating tape77 and the side surface 7551 of the first conductive tape 75 may be, forexample, 1 to 1.5 mm. In other words, a width in the second directionDR2 of a part of the first conductive tape 75 exposed by the secondinsulating tape 77 may be 1 to 1.5 mm.

FIG. 8 illustrates induction of external static electricity through theelectrostatic induction opening OP2.

Referring to FIG. 8, a gap between the display panel 10 of the displaydevice 1 and the external device and the surrounding set structuredisposed on the display panel 10 is narrow. In addition, when thedisplay device 1 is bent, the driving chip 30 is positioned outside theprinted circuit film 50 (for example, in the direction opposite to thedirection toward the display area DA) and thus located on the peripheryof the display device 1 as described above. The driving chip 30 locatedon the periphery and the driving pads connected to the driving chip 30may be vulnerable to static electricity introduced directly from theoutside. In addition, since the driving chip 30 and the driving padsconnected to the driving chip 30 are disposed adjacent to thesurrounding set structure, they may be vulnerable to static electricitytransferred from the surrounding set structure into which staticelectricity has been initially introduced. The static electricityintroduced directly from the outside and the static electricityintroduced indirectly may cause a failure of in the driving chip 30 andthe driving pads, and the failure may cause a screen failure of thedisplay device 1.

When external static electricity is present, a static electricityportion ESD may be introduced through the exposed side surface 75S1 ofthe first conductive tape 75, and this introduced static electricityportion ESD may be induced or diverted through the first conductive tape75 and the electrostatic transfer openings OP1 to the printed circuitfilm 50, to which the ground voltage has been applied through the secondconductive tape 81, to safely discharge this static electricity portionESD. However, when the first conductive tape 75 has a relatively smallthickness of about 15 μm or less, the amount of the divertible staticelectricity portion ESD introduced through the exposed side surface 75S1of the first conductive tape 75 may be insignificant, or almost none.Without a path to divert a greater portion of the external staticelectricity introduced directly from the outside and the staticelectricity introduced indirectly, without being intercepted by theconductive layer 75 and diverted through the transfer openings OP1, suchstatic electricity might be undesirably applied to the driving chip 30located on the periphery and the driving pads connected to the drivingchip 30.

Thus, the cover member 70 of the display device 1 according to thisexemplary embodiment includes the second electrostatic induction openingOP2, which is considerably wider than the exposed side surface 75S1 ofthe first conductive tape 75, and this electrostatic induction openingOP2 induces a greater portion or substantially all of the staticelectricity introduced directly from the outside and the staticelectricity introduced indirectly through the conductive layer 75 to bediverted through the first electrostatic transfer openings OP1 to thegrounded printed circuit film 50. Therefore, it is possible to preventstatic electricity from being applied to the driving chip 30 located onthe periphery and the driving pads connected to the driving chip 30,thereby preventing a screen failure of the display device 1. Althoughthree electrostatic induction openings OP1 are provided in thisexemplary embodiment, it shall be understood that alternate embodimentsmay include any greater or lesser number of electrostatic inductionopenings OP1, such as one or twenty, without limitation.

FIG. 9 illustrates a plan view of a non-display area NDA of a displaypanel 10 according to an embodiment, a driving chip 30, a printedcircuit film 50, a cover member, and a step compensation member 80 whenthe display panel 10 is unbent. FIG. 10 illustrates a cross-sectionalview taken along line II-II′ of FIG. 9 when the display panel 10 isbent. FIG. 11 illustrates a cross-sectional view taken along lineIII-III′ of FIG. 9 when the display panel 10 is bent.

Referring to FIGS. 9 through 11, a display device 2 according to thecurrent embodiment is different from the display device 1 of FIGS. 6 and7 in that an electrostatic induction opening OP2_1 is located between asecond end 75 b of a first conductive tape 75 and a second end 77 b_1 ofa second insulating tape 77_1.

More specifically, in the display device 2 according to the currentembodiment, the electrostatic induction opening OP2_1 may be locatedbetween the second end 75 b of the first conductive tape 75 and thesecond end 77 b_1 of the second insulating tape 77_1. Further, anelectrostatic induction opening OP2_2 may be disposed between a thirdend 75 c of the first conductive tape 75 and a third end 77 c_1 of thesecond insulating tape 77_1.

First ends 71 a and 75 a of a first insulating tape 71 and the firstconductive tape 75 may be aligned with a first end 77 a_1 of the secondinsulating tape 77_1. Second ends 71 b and 75 b of the first insulatingtape 71 and the first conductive tape 75 may not be aligned with thesecond end 77 b_1 of the second insulating tape 77_1 and may beasymmetrical to the second end 77 b_1 of the second insulating tape 77_1in the thickness direction.

For example, the second ends 71 b and 75 b of the first insulating tape71 and the first conductive tape 75 may be located farther from thedriving chip 30 than the second end 77 b_1 of the second insulating tape77_1. Likewise, third ends 71 c and 75 c of the first insulating tape 71and the first conductive tape 75 may be located farther from the drivingchip 30 than the third end 77 c_1 of the second insulating tape 77_1. Asdescribed above, a planar size of the second insulating tape 77_1 may besmaller than a planar size of the first conductive tape 75. This may bebecause the second and third ends 77 b_1 and 77 c_1 of the secondinsulating tape 77_1 are located closer to the driving chip 30 than thesecond and third ends 71 b, 75 b, 71 c and 75 c of the first insulatingtape 71 and the first conductive tape 75.

Each of the first insulating tape 71 and the first conductive tape 75may protrude from the second and third ends 77 b_1 and 77 c_1 of thesecond insulating tape 77 in directions away from the driving chip 30.The electrostatic induction openings OP2_1 and OP2_2 of the secondinsulating tape 77_1 may be located in each of the protruding parts. Inplan view, the electrostatic induction opening OP2_1 may be locatedbetween the second end 75 b of the first conductive tape 75 and thesecond end 77 b_1 of the second insulating tape 77_1 and theelectrostatic induction opening OP2_2 may be located between the thirdend 75 c of the first conductive tape 75 and the third end 77 c_1 of thesecond insulating tape 77_1.

In the electrostatic induction opening OP2_1, a part of the firstconductive tape 75 which protrudes from the second end 77 b_1 of thesecond insulating tape 77_1 in the direction away from the driving chip30 may be completely exposed to the outside. Similarly, in theelectrostatic induction opening OP2_2, a part of the first conductivetape 75 which protrudes from the third end 77 c_1 of the secondinsulating tape 77_1 in the direction away from the driving chip 30 maybe completely exposed to the outside.

Each of the first insulating tape 71, the first conductive tape 75 andthe second insulating tape 77_1 may include side surfaces correspondingto its ends. A side surface 7551 of the first end 71 a of the firstconductive tape 75 may be aligned with a side surface 77_1S1 of thefirst end 77 a_1 of the second insulating tape 77_1. Side surfaces77_1S2 and 77_1S3 of the second end 77 b_1 and the third end 77 c_1 ofthe second insulating tape 77_1 may be located closer to the drivingchip 30 than side surfaces 75S2 and 75S3 of the second end 75 b and thethird end 75 c of the first conductive tape 75, respectively.

In the current embodiment, the electrostatic induction openings OP2_1and OP2_2, which are considerably wider than the exposed side surface7551 of the first conductive tape 75, may also be included to inducestatic electricity introduced directly from the outside and staticelectricity introduced indirectly. Therefore, it is possible to preventstatic electricity from being applied to the driving chip 30 located onthe periphery and driving pads connected to the driving chip 30, therebypreventing a screen failure of the display device 2. In alternateembodiments, electrostatic induction openings OP2_1 and/or OP2_2 may beincluded without limitation.

FIG. 12 illustrates a plan view of a non-display area NDA of a displaypanel 10 according to an embodiment, a driving chip 30, a printedcircuit film 50, a cover member, and a step compensation member 80 whenthe display panel 10 is unbent.

Referring to FIG. 12, a display device 3 according to the currentembodiment is different from the display device 1 including theelectrostatic induction opening OP2 described above with reference toFIGS. 6 and 7 in that it further includes the electrostatic inductionopenings OP2_1 and OP2_2 described above with reference to FIGS. 9through 11.

More specifically, a second insulating tape 77_2 of the display device 3according to the current embodiment may include the electrostaticinduction openings OP2_1 and OP2_2 described above with reference toFIGS. 9 through 11, and the electrostatic induction opening OP2described above with reference to FIGS. 6 and 7.

The electrostatic induction opening OP2 and the electrostatic inductionopenings OP2_1 and OP2_2 of the display device 3 according to thecurrent embodiment may surround the driving chip 30 from the first sideof the second direction DR2 and the first and second sides of the firstdirection DR1.

In the current embodiment, the electrostatic induction openings OP2,OP2_1 and OP2_2, which are considerably wider than an exposed sidesurface 75S1 of a first conductive tape 75, may also be included toinduce static electricity introduced directly from the outside andstatic electricity introduced indirectly towards ground. Therefore, itis possible to prevent static electricity from being applied to thedriving chip 30 located on the periphery and driving pads connected tothe driving chip 30, thereby preventing a screen failure of the displaydevice 3.

FIG. 13 illustrates a cross-sectional view of a display device 4according to an embodiment.

Referring to FIG. 13, the display device 4 according to the currentembodiment is different from the display device 1 according to theembodiment of FIG. 7 in that a cover member further includes aconductive layer 86 disposed on a second insulting tape 77_3.

More specifically, in the display device 4 according to the currentembodiment, the cover member may further include the conductive layer 86disposed on the second insulating tape 77_3.

In the cover member according to the current embodiment, side surfaces71S1 and 75S1 of a first insulating tape 71 and a first conductive tape75 may be aligned with a side surface 77_3S1 of the second insulatingtape 77_3.

The second insulating tape 77_3 may be disposed between the conductivelayer 86 and the first conductive tape 75. The conductive layer 86 maybe disposed on an edge part (adjacent to a bending area BA) of thesecond insulating tape 77_3. The conductive layer 86 may overlap theedge part (adjacent to the bending area BA) of the second insulatingtape 77_3 in the thickness direction. The side surface 71S1 of the firstinsulating tape 71, the side surface 75S1 of the first conductive tape75, and the side surface 77_3S1 of the second insulating tape 77_3 maybe exposed to the outside.

The conductive layer 86 may include at least one of the materialsmentioned as example materials of a second base 76 of the firstconductive tape 75.

In the current embodiment, since the display device 4 further includesthe conductive layer 86 overlapping, in the thickness direction, theedge part (adjacent to the bending area BA) of the second insulatingtape 77_3 located on an outermost side of the cover member, staticelectricity introduced directly from the outside and static electricityintroduced indirectly may be induced to the conductive layer 86 andconducted to the first conductive tape 75 because the second insulatingtape 77_3 is thinner than the first conductive tape 75. Therefore, it ispossible to prevent static electricity from being applied to a drivingchip 30 located on the periphery and driving pads connected to thedriving chip 30, thereby preventing a screen failure of the displaydevice 4. In an alternate embodiment where the second insulating tape77_3 need not be thinner than the first conductive tape 75, theconductive layer 86 may be disposed on an electrostatic inductionopening OP3 that extends through the second insulating tape 77_3 to thefirst conductive tape 75.

FIG. 14 illustrates a cross-sectional view of a display device 5according to an embodiment.

Referring to FIG. 14, the display device 5 according to the currentembodiment is different from the display device 4 of FIG. 13 in that aconductive layer 86_1 is further disposed on a side surface 77_3S1 of asecond insulating tape 77_3 and a side surface 75S1 of a firstconductive tape 75.

More specifically, in the display device 5 according to the currentembodiment, the conductive layer 86_1 may be further disposed on theside surface 77_3S1 of the second insulating tape 77_3 and the sidesurface 7551 of the first conductive tape 75.

Since the conductive layer 86_1 is further disposed on the side surface77_3S1 of the second insulating tape 77_3 and the side surface 7551 ofthe first conductive tape 75, it may be electrically connected to thefirst conductive tape 75.

In the current embodiment, since the display device 5 further includesthe conductive layer 86_1 overlapping, in the thickness direction, anedge part (adjacent to a bending area BA) of the second insulating tape77_3 located on an outermost side of the cover member, staticelectricity introduced directly from the outside and static electricityintroduced indirectly may be induced to the conductive layer 86_1 andconducted directly to the first conductive tape 75. Therefore, it ispossible to prevent static electricity from being applied to a drivingchip 30 located on the periphery and driving pads connected to thedriving chip 30, thereby preventing a screen failure of the displaydevice 5. In an alternate embodiment, the conductive layer 86_1 may bedisposed on an electrostatic induction opening OP3 that extends throughthe second insulating tape 77_3 to the first conductive tape 75.

In a display device according to the present disclosure, display screenfailures due to external stress, for example, static electricity can beimproved.

However, the effects of the embodiments are not restricted to the oneset forth herein. The above and other effects of the embodiments willbecome more apparent to one of daily skill in the art to which theembodiments pertain by referencing the claims.

While the present disclosure has been particularly shown and describedwith reference to exemplary embodiments thereof, it will be understoodby those of ordinary skill in the pertinent art that various changes inform and details may be made herein without departing from the scope orspirit of the present disclosure as defined by the following claims andtheir equivalents. The exemplary embodiments should be considered in adescriptive sense, only, and not for purposes of limitation.

What is claimed is:
 1. A display device comprising: a display panel inwhich a display area and a non-display area located around the displayarea are defined; an external device which is disposed on thenon-display area of the display panel; and a cover member which isdisposed on the external device, wherein the external device comprises adriving chip and a printed circuit film which is disposed on thenon-display area of the display panel and spaced apart from the displayarea with the driving chip interposed between the printed circuit filmand the display area in plan view, wherein the cover member comprises afirst insulating tape disposed on the external device, a firstconductive tape disposed on the first insulating tape and a secondinsulating tape disposed on the first conductive tape, wherein thesecond insulating tape comprises an electrostatic induction openingpenetrating the second insulating tape in a thickness direction, whereina planar size of the first conductive tape is greater than a planar sizeof the second insulating tape, wherein the first conductive tapeprotrudes further toward the display area than the second insulatingtape in plan view, and wherein the electrostatic induction opening isdisposed on a part of the first conductive tape which protrudes furthertoward the display area than the second insulating tape.
 2. The displaydevice of claim 1, wherein the first insulating tape is disposed betweenthe first conductive tape and the external device, and the firstconductive tape is disposed between the first insulating tape and thesecond insulating tape.
 3. The display device of claim 2, wherein thefirst insulating tape comprises an electrostatic transfer openingoverlapping the printed circuit film, and the electrostatic transferopening completely penetrates the first insulating tape in the thicknessdirection.
 4. The display device of claim 3, wherein the cover memberfurther comprises a second conductive tape disposed in the electrostatictransfer opening, the second conductive tape is disposed between thefirst conductive tape and the printed circuit film, the secondconductive tape is configured to electrically connect the firstconductive tape and the printed circuit film, and the printed circuitfilm is configured to receive a ground voltage.
 5. The display device ofclaim 4, wherein the non-display area further comprises a bending arealocated between the driving chip and the display area in plan view, andthe display panel is bent in the thickness direction in the bendingarea.
 6. The display device of claim 5, further comprising a bendingprotection layer which is disposed on the bending area of the displaypanel.
 7. The display device of claim 6, further comprising a stepcompensation member which is disposed between the display panel and thefirst insulating tape.
 8. The display device of claim 7, wherein thestep compensation member comprises a first step compensation memberdisposed between the display panel and the first insulating tape and asecond step compensation member disposed between the first stepcompensation member and the first insulating tape, and an inner sidesurface of the first step compensation member is located farther fromthe bending area than an inner side surface of the second stepcompensation member.
 9. The display device of claim 5, wherein each ofthe first conductive tape and the second insulating tape comprises afirst end extending along a first direction and adjacent to the bendingarea and a second end extending along a second direction intersectingthe first direction and connected to the first end, and the driving chipand the printed circuit film are spaced apart from each other along thesecond direction.
 10. The display device of claim 9, wherein the firstend of the second insulating tape is located closer to the externaldevice than the first end of the first conductive tape in plan view, andthe second end of the first conductive tape and the second end of thesecond insulating tape are aligned with each other.
 11. The displaydevice of claim 9, wherein the second end of the second insulating tapeis located closer to the external device than the second end of thefirst conductive tape in plan view, and the first end of the firstconductive tape and the first end of the second insulating tape arealigned with each other.
 12. The display device of claim 9, wherein thefirst end of the second insulating tape is located closer to theexternal device than the first end of the first conductive tape in planview, the second end of the second insulating tape is located closer tothe external device than the second end of the first conductive tape inplan view.
 13. The display device of claim 5, wherein each of the firstconductive tape and the second conductive tape comprises a side surfaceadjacent to the bending area, and the side surface of the secondinsulating tape is located farther from the bending area than the sidesurface of the first conductive tape.
 14. The display device of claim 4,wherein a folding area, a first non-folding area located on a side ofthe folding area, and a second non-folding area located on the otherside of the folding area are further defined in the display panel.
 15. Adisplay device comprising: a display panel in which a display area and anon-display area located around the display area are defined; anexternal device which is disposed on the non-display area of the displaypanel; and a cover member which is disposed on the external device,wherein the external device comprises a driving chip and a printedcircuit film which is disposed on the non-display area of the displaypanel and spaced apart from the display area with the driving chipinterposed between the printed circuit film and the display area in planview, wherein the cover member comprises a first insulating tapedisposed on the external device, a first conductive tape disposed on thefirst insulating tape, a second insulating tape disposed on the firstconductive tape and a conductive layer disposed on the second insulatingtape, wherein the non-display area further comprises a bending arealocated between the driving chip and the display area in plan view andextending along a first direction, wherein when the display panel is ina first bent state, it is bent in a thickness direction in the bendingarea, wherein when the display panel is in a second unbent state, thedriving chip and the printed circuit film are spaced apart from eachother along a second direction intersecting the first direction, whereinthe second insulating tape comprises an edge part extending along thefirst direction and adjacent to the bending area, and wherein theconductive layer overlaps the edge part of the second insulating tape.16. The display device of claim 15, wherein each of the first insulatingtape, the second insulating tape and the first conductive tape comprisesa side surface adjacent to the bending area, and the side surfaces ofthe first insulating tape, the second insulating tape and the firstconductive tape are exposed.
 17. The display device of claim 15, whereineach of the first insulating tape, the second insulating tape and thefirst conductive tape comprises a side surface adjacent to the bendingarea, and the conductive layer is further disposed on the side surfacesof the second insulating tape and the first conductive tape.
 18. Thedisplay device of claim 17, wherein the first insulating tape comprisesan electrostatic transfer opening overlapping the printed circuit film,the electrostatic transfer opening completely penetrates the firstinsulating tape in the thickness direction, and the cover member furthercomprises a second conductive tape disposed in the electrostatictransfer opening, wherein the second conductive tape is disposed betweenthe first conductive tape and the printed circuit film, the secondconductive tape is configured to electrically connect the firstconductive tape and the printed circuit film, and the printed circuitfilm is configured to receive a ground voltage.
 19. The display deviceof claim 18, wherein the non-display area further comprises a bendingarea located between the driving chip and the display area in plan view,and the display panel is bent in the thickness direction in the bendingarea, and further comprising a bending protection layer disposed on thebending area of the display panel.
 20. The display device of claim 19,further comprising a step compensation member which is disposed betweenthe display panel and the first insulating tape, wherein the stepcompensation member comprises a first step compensation member disposedbetween the display panel and the first insulating tape and a secondstep compensation member disposed between the first step compensationmember and the first insulating tape, and an inner side surface of thefirst step compensation member is located farther from the bending areathan an inner side surface of the second step compensation member.
 21. Aflexible display panel comprising: a display area; a non-display arealocated around the display area; a grounded film disposed on thenon-display area and spaced apart from the display area; a coverdisposed on the grounded film and comprising a first insulating tapedisposed on the grounded film, a conductive tape disposed on the firstinsulating tape, and a second insulating tape disposed on the conductivetape, wherein the first insulating tape comprises at least oneelectrostatic transfer opening extending between the conductive tape andthe grounded film.
 22. The flexible display panel of claim 21, furthercomprising an electrostatic induction opening defined where a planarsize of the conductive tape is greater than a planar size of the secondinsulating tape.
 23. The flexible display panel of claim 21, furthercomprising an electrostatic induction opening defined where theconductive tape extends further towards the display area than the secondinsulating tape.
 24. The flexible display panel of claim 21, furthercomprising an electrostatic induction opening defined where theconductive tape extends further perpendicular to the display area thanthe second insulating tape.
 25. The flexible display panel of claim 21wherein the at least one electrostatic transfer opening is disposed in apart of the first insulating tape where the conductive tape extendsfurther towards the display area than the second insulating tape to forman electrostatic induction opening.
 26. The flexible display panel ofclaim 21 wherein the second insulating tape is thinner than theconductive tape, further comprising a conductive layer disposed on thesecond insulating tape to form an electrostatic attractor.
 27. Theflexible display panel of claim 21, further comprising a conductivesleeve disposed in the at least one electrostatic transfer openingbetween the conductive tape and the grounded film, the conductive sleeveconfigured to electrically connect the conductive tape to the groundedfilm.